- Work in an engaged multi-cultural team with global footprint, co-operate with internal and external development and production partners
- Having as Package Architect the leading responsibility for functionality and performance of SiC Diodes Packages and "Bare Die" first-level interconnect technologies
- Interfacing to global package and assembly development community
- Collect technical customer needs, market trends and benchmarking information concerning SiC packages. Propose own innovative solutions
- Support all Business Group functions with SiC power package expertise
- Pro-active Package Requirements Management and road-mapping derived from product roadmaps and market trends
- University degree in Semiconductor Packaging, Physics, Materials Technology, Electronics Engineering or similar
- Extensive knowledge of semiconductor packages, assembly materials and assembly processes
- 5 years of experience in power package development, including experience in Clip-bonding technologies
- 3 years of experience in SiC or GaN packaging and "Bare Die" processing. Very good understanding of related technologies
- Strong skills in architectural thinking, critical judgement and fast and structured problem solving
- Energetic and result driven, technical Leader with ambition to grow
- Excellent communication skills and team player within global, intercultural environment
- Fluent Business English
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Development Engineer SiC Power Devices
发现在: Talent CN S2 - 3小时前
Nexperia Shanghai, 中国About this role · In this exciting role you will be responsible for the development and release of Silicon Carbide (SiC) products. · This is your new job · Develop SiC products from product definition to final release for production · Responsible for functionality & performance ...
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Principal PAE SiC, China
发现在: Talent CN S2 - 3小时前
Nexperia Shanghai, 中国About the role · Based on detailed application-product expertise and technical excellence the Product Application Engineer provides in-depth technical customer support for Bipolar product portfolio with focus on Power / WBG Products (e.g. SiC). Via technical collateral creation ...
Senior Principal Engineer SiC Packaging - Shanghai, 中国 - Nexperia
描述
This is you
What you will need
This is your department and colleagues
From our Shanghai office you will work with an engaged multi-cultural team with a global footprint.
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Nexperia is an Equal Opportunity/Affirmative Action Employer.