Intel

DIFF Process Engineer (BB-06FFE)

Found in: Neuvoo CN

Description:

Job Description :

Job Description

Process Engineers develop and sustain such processes as diffusion, etching, plating, lithographic printing, thin film deposition in semiconductor fab manufacturing operations. Plans and implements capacity, and operational improvements to maximize output while improving the safety and quality of operations. As module owner, conducts tests and measurements of their operations to determine control over critical dimensions and defectivity of the process line. Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products. Establishes and submits processing requirements to be met in designing and acquiring processing equipment. Exercise independent judgement and discretion by making recommendations and adjusting tools and processes reactively when something has changed on the line or proactively in order to maximize output. Develops solutions to problems utilizing formal education and judgement.
This position is associated with the sale of Intel's NAND memory and storagebusiness to SK Hynix (You can read more about the transaction in thepress release - ). The transaction will enhance the resources and potential ofthe business' storagesolutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.

This is an exciting timeto be at Intel – come join our NAND-DTM and work on the most advanced 3DNAND and SSD technology in theworld.As the global leader in the semiconductor industry, Intel possesses industry-leading SSD technology and the most capable Quadruple Level Cell(QLC) NAND Flash products, and you will be part of a world-class team that will transition to lead the SSD business at SK Hynix.

This position aligns to Phase 2 of the transaction, which includesNAND technology and component development along withfab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology andcomponents and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK Hynix.

Qualifications


1. PhD degree is required. Major in chemistry, applied physics, materials or EE.
2. Good communication skill both English and Mandarin.
3. Teamwork, passion be a engineer, good logical thinking and hands on skills. Fast learnerInside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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